Wafer Edge Grinder for Semiconductor Crystal Boules

Specialized grinder for precise edge profiling and deburring silicon wafer edges post-slicing from monocrystalline boules. HTS 8460.39.0050 covers this as a tool grinding machine for semiconductor processing per statistical notes on wafer preparation. Critical for flatness in chip fabrication.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+35.0%39.4%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪Germany4.4%+10.0%14.4%
🇯🇵Japan4.4%+10.0%14.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8486.90.00Lower: 25% vs 39.4%

If parts for semiconductor manufacturing machines

Disassembled grinders or components classify under semiconductor machine parts.

9031.49Lower: 10% vs 39.4%

If for final wafer testing polishing

Statistical notes place testing apparatus in Chapter 90, separate from prep grinding.

8479.50.00Lower: 37.5% vs 39.4%

If industrial semiconductor processing class

Fully integrated wafer prep lines may fall under specialized industrial machinery.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Reference statistical note (a)(ii) in entry docs to justify semiconductor classification

Include cleanroom compatibility certs and material safety data for silicon handling

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