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8460.24.00.80/Numerically Controlled Wafer Thickness Grinder/Mexico

Numerically Controlled Wafer Thickness Grinder from Mexico

Precision NC grinder maintaining uniform wafer thickness across 300mm+ diameters for semiconductor processing, using diamond wheels on metal surfaces. Falls under HTS 8460.24.00.80 per statistical note on wafer grinders, lappers, polishers for dimensional tolerances.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Include TTV (total thickness variation) specifications and in-process measurement capability

• Verify diamond abrasive wheel specs for cermet/semiconductor classification

Numerically Controlled Wafer Thickness Grinder from Mexico — Import Duty Rate | HTS 8460.24.00.80