8460.24.00.80/Numerically Controlled Wafer Thickness Grinder/Japan

Numerically Controlled Wafer Thickness Grinder from Japan

Precision NC grinder maintaining uniform wafer thickness across 300mm+ diameters for semiconductor processing, using diamond wheels on metal surfaces. Falls under HTS 8460.24.00.80 per statistical note on wafer grinders, lappers, polishers for dimensional tolerances.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include TTV (total thickness variation) specifications and in-process measurement capability

• Verify diamond abrasive wheel specs for cermet/semiconductor classification