8460.24.00.80/Numerically Controlled Wafer Thickness Grinder/Germany

Numerically Controlled Wafer Thickness Grinder from Germany

Precision NC grinder maintaining uniform wafer thickness across 300mm+ diameters for semiconductor processing, using diamond wheels on metal surfaces. Falls under HTS 8460.24.00.80 per statistical note on wafer grinders, lappers, polishers for dimensional tolerances.

Duty Rate — Germany → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include TTV (total thickness variation) specifications and in-process measurement capability

• Verify diamond abrasive wheel specs for cermet/semiconductor classification

Numerically Controlled Wafer Thickness Grinder from Germany — Import Duty Rate | HTS 8460.24.00.80