Numerically Controlled Wafer Thickness Grinder from Canada
Precision NC grinder maintaining uniform wafer thickness across 300mm+ diameters for semiconductor processing, using diamond wheels on metal surfaces. Falls under HTS 8460.24.00.80 per statistical note on wafer grinders, lappers, polishers for dimensional tolerances.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include TTV (total thickness variation) specifications and in-process measurement capability
• Verify diamond abrasive wheel specs for cermet/semiconductor classification