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Numerically Controlled Czochralski Boule Grinder from Mexico

NC grinding machine specifically designed for Czochralski method silicon boules, grinding to precise diameters post-crystal pulling for semiconductor wafer production. HTS 8460.24.00.80 as numerically controlled abrasive grinding for semiconductor boule finishing per statistical note (a)(ii)(A).

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

Import Tips

Specify Czochralski boule compatibility and diameter grinding range (100-450mm) in technical specs

Reference statistical note (a)(i) crystal growers context to support semiconductor-specific classification

Avoid combining with slicing equipment documentation to prevent set classification

Numerically Controlled Czochralski Boule Grinder from Mexico — Import Duty Rate | HTS 8460.24.00.80