Numerically Controlled Czochralski Boule Grinder from Canada
NC grinding machine specifically designed for Czochralski method silicon boules, grinding to precise diameters post-crystal pulling for semiconductor wafer production. HTS 8460.24.00.80 as numerically controlled abrasive grinding for semiconductor boule finishing per statistical note (a)(ii)(A).
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify Czochralski boule compatibility and diameter grinding range (100-450mm) in technical specs
• Reference statistical note (a)(i) crystal growers context to support semiconductor-specific classification
• Avoid combining with slicing equipment documentation to prevent set classification