Numerically Controlled Crystal Boule Flat Grinder from Mexico
Precision NC grinding machine that creates orientation flats on silicon or gallium arsenide crystal boules to indicate resistivity and conductivity type for semiconductor wafer slicing. Classified in HTS 8460.24.00.80 as numerically controlled grinding equipment using abrasives for cermet/semiconductor finishing per statistical notes on wafer preparation.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Documentation must specify flat-grinding for semiconductor boule resistivity marking to avoid general metal grinding classification
• Include boule diameter range (150-450mm typical) and flat positioning accuracy specs in technical data sheets