Numerically Controlled Crystal Boule Flat Grinder from Germany
Precision NC grinding machine that creates orientation flats on silicon or gallium arsenide crystal boules to indicate resistivity and conductivity type for semiconductor wafer slicing. Classified in HTS 8460.24.00.80 as numerically controlled grinding equipment using abrasives for cermet/semiconductor finishing per statistical notes on wafer preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Documentation must specify flat-grinding for semiconductor boule resistivity marking to avoid general metal grinding classification
• Include boule diameter range (150-450mm typical) and flat positioning accuracy specs in technical data sheets