</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8460.24.00.80/NC Wafer Edge Profiling Grinder/Canada

NC Wafer Edge Profiling Grinder from Canada

Numerically controlled edge grinding machine that profiles semiconductor wafer edges to precise specifications, preventing chipping during handling and processing. HTS 8460.24.00.80 classification for NC abrasive grinding machines finishing semiconductor wafers, supporting statistical note on wafer preparation equipment.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify edge profiling tolerances (chamfer angles, radius specs) to confirm semiconductor-specific design

• Include vacuum chuck specifications for wafer holding in import documentation

NC Wafer Edge Profiling Grinder from Canada — Import Duty Rate | HTS 8460.24.00.80