NC Float Zone Silicon Ingot Grinder from Japan
Numerically controlled grinding machine for float zone method silicon ingots, preparing surfaces for semiconductor device fabrication by abrasive finishing. Classified HTS 8460.24.00.80 for NC grinding of semiconductor materials per statistical notes on crystal preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Documentation must reference float zone method and ingot diameter specifications for proper classification
• Include resistivity flat grinding capability details for semiconductor identification