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8460.24.00.80/NC Float Zone Silicon Ingot Grinder/Japan

NC Float Zone Silicon Ingot Grinder from Japan

Numerically controlled grinding machine for float zone method silicon ingots, preparing surfaces for semiconductor device fabrication by abrasive finishing. Classified HTS 8460.24.00.80 for NC grinding of semiconductor materials per statistical notes on crystal preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Documentation must reference float zone method and ingot diameter specifications for proper classification

• Include resistivity flat grinding capability details for semiconductor identification

NC Float Zone Silicon Ingot Grinder from Japan — Import Duty Rate | HTS 8460.24.00.80