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8460.24.00.80/CNC Semiconductor Wafer Notch Grinder/Mexico

CNC Semiconductor Wafer Notch Grinder from Mexico

Numerically controlled machine grinding precise notches in semiconductor wafers for crystal orientation identification during processing. HTS 8460.24.00.80 classification for NC abrasive grinding of semiconductor wafers.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document notch positioning accuracy and wafer size compatibility (200/300mm)

• Distinguish from flat grinding by specifying notch geometry specs