8460.24.00.80/CNC Semiconductor Wafer Notch Grinder/Japan

CNC Semiconductor Wafer Notch Grinder from Japan

Numerically controlled machine grinding precise notches in semiconductor wafers for crystal orientation identification during processing. HTS 8460.24.00.80 classification for NC abrasive grinding of semiconductor wafers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document notch positioning accuracy and wafer size compatibility (200/300mm)

• Distinguish from flat grinding by specifying notch geometry specs