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8460.24.00.80/CNC Semiconductor Wafer Notch Grinder/Germany

CNC Semiconductor Wafer Notch Grinder from Germany

Numerically controlled machine grinding precise notches in semiconductor wafers for crystal orientation identification during processing. HTS 8460.24.00.80 classification for NC abrasive grinding of semiconductor wafers.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Document notch positioning accuracy and wafer size compatibility (200/300mm)

• Distinguish from flat grinding by specifying notch geometry specs

CNC Semiconductor Wafer Notch Grinder from Germany — Import Duty Rate | HTS 8460.24.00.80