Precision NC Internal Grinder for Crystal Puller Bearings from Japan
A specialized numerically controlled grinding machine for finishing internal diameters of bearings in Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. It uses abrasive wheels for mirror finishes essential to prevent contamination in crystal growth processes. Falls under HTS 8460.23.0065 as an internal cylindrical grinder for metal parts in semiconductor crystal manufacturing equipment.
Duty Rate — Japan → United States
Rate breakdown
Import Tips
• Document the machine's role in semiconductor boule production with engineering drawings to support correct HTS classification
• Verify that import documentation specifies 'internal cylindrical' capability to distinguish from external grinders
• Be prepared for additional scrutiny on vibration isolation features, common in semiconductor grinding equipment