Internal cylindrical
Machine tools for deburring, sharpening, grinding, honing, lapping, polishing or otherwise finishing metal or cermets by means of grinding stones, abrasives or polishing products, other than gear cutting, gear grinding or gear finishing machines of heading 8461: > Other grinding machines: > Other cylindrical grinding machines, numerically controlled > Other: > Internal cylindrical
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8460.23.00.65
Numerically Controlled Internal Cylindrical Grinder for Semiconductor Wafer Spindles
This machine tool is designed for precision grinding of internal cylindrical surfaces on spindles used in semiconductor wafer processing equipment. It employs numerically controlled operations with grinding stones to achieve sub-micron tolerances required for high-precision semiconductor manufacturing. Classified under HTS 8460.23.0065 as an other internal cylindrical grinding machine, numerically controlled, specifically for finishing metal components in wafer fabrication tools.
Precision NC Internal Grinder for Crystal Puller Bearings
A specialized numerically controlled grinding machine for finishing internal diameters of bearings in Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. It uses abrasive wheels for mirror finishes essential to prevent contamination in crystal growth processes. Falls under HTS 8460.23.0065 as an internal cylindrical grinder for metal parts in semiconductor crystal manufacturing equipment.
NC Internal Cylindrical Honing Machine for Wafer Slicing Saw Arbor
This numerically controlled machine performs internal cylindrical honing on arbors of wafer slicing saws that cut monocrystalline boules into semiconductor wafers. It achieves the exacting surface finishes needed for precise, contamination-free slicing operations. Classified in HTS 8460.23.0065 for internal cylindrical finishing of metal components in semiconductor wafer preparation equipment.
High-Precision NC Grinder for Wafer Grinder Spindle Housings
Numerically controlled internal cylindrical grinder designed for finishing spindle housings in wafer grinding machines that prepare semiconductor wafers to exact flatness specifications. Essential for maintaining nanoscale surface quality in wafer preparation for fabrication. HTS 8460.23.0065 classification applies to this internal finishing machine for semiconductor processing metal parts.
NC Internal Diameter Grinder for Crystal Boule Grinder Shafts
Specialized CNC machine for precision grinding internal diameters of shafts in crystal boule grinders that shape semiconductor crystal ingots to wafer specifications. Delivers the surface integrity needed for ultra-pure crystal processing environments. Fits HTS 8460.23.0065 as numerically controlled internal cylindrical grinder for semiconductor material processing equipment.