NC Internal Diameter Grinder for Crystal Boule Grinder Shafts from China
Specialized CNC machine for precision grinding internal diameters of shafts in crystal boule grinders that shape semiconductor crystal ingots to wafer specifications. Delivers the surface integrity needed for ultra-pure crystal processing environments. Fits HTS 8460.23.0065 as numerically controlled internal cylindrical grinder for semiconductor material processing equipment.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Submit detailed process flow diagrams showing integration into Czochralski or float zone crystal processing
• Ensure machine safety interlocks comply with OSHA standards for US market entry
• Use ISF filings early for semiconductor equipment to avoid delays in classification rulings