NC Internal Cylindrical Honing Machine for Wafer Slicing Saw Arbor from Japan
This numerically controlled machine performs internal cylindrical honing on arbors of wafer slicing saws that cut monocrystalline boules into semiconductor wafers. It achieves the exacting surface finishes needed for precise, contamination-free slicing operations. Classified in HTS 8460.23.0065 for internal cylindrical finishing of metal components in semiconductor wafer preparation equipment.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include saw manufacturer specifications showing arbor tolerances to justify classification as precision finishing equipment
• Maintain records of abrasive specifications used, as Customs may verify grinding stone compatibility
• Label shipments clearly as 'semiconductor equipment components' to expedite processing