8460.23.00.65/Numerically Controlled Internal Cylindrical Grinder for Semiconductor Wafer Spindles/Japan

Numerically Controlled Internal Cylindrical Grinder for Semiconductor Wafer Spindles from Japan

This machine tool is designed for precision grinding of internal cylindrical surfaces on spindles used in semiconductor wafer processing equipment. It employs numerically controlled operations with grinding stones to achieve sub-micron tolerances required for high-precision semiconductor manufacturing. Classified under HTS 8460.23.0065 as an other internal cylindrical grinding machine, numerically controlled, specifically for finishing metal components in wafer fabrication tools.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Provide detailed technical specifications confirming numerical control and internal cylindrical grinding function to avoid misclassification as non-NC machinery

• Include end-user statements specifying use in semiconductor equipment manufacturing to qualify for potential duty relief programs

• Ensure machine calibration certificates are available, as US Customs may inspect for compliance with precision finishing standards