8460.23.00.65/Numerically Controlled Internal Cylindrical Grinder for Semiconductor Wafer Spindles/Germany

Numerically Controlled Internal Cylindrical Grinder for Semiconductor Wafer Spindles from Germany

This machine tool is designed for precision grinding of internal cylindrical surfaces on spindles used in semiconductor wafer processing equipment. It employs numerically controlled operations with grinding stones to achieve sub-micron tolerances required for high-precision semiconductor manufacturing. Classified under HTS 8460.23.0065 as an other internal cylindrical grinding machine, numerically controlled, specifically for finishing metal components in wafer fabrication tools.

Duty Rate — Germany → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Provide detailed technical specifications confirming numerical control and internal cylindrical grinding function to avoid misclassification as non-NC machinery

• Include end-user statements specifying use in semiconductor equipment manufacturing to qualify for potential duty relief programs

• Ensure machine calibration certificates are available, as US Customs may inspect for compliance with precision finishing standards

Numerically Controlled Internal Cylindrical Grinder for Semiconductor Wafer Spindles from Germany — Import Duty Rate | HTS 8460.23.00.65