Refurbished DMG Mori NTY3000 5-Axis Boring Machine from Japan
Used 5-axis numerically controlled boring-milling center rebuilt for semiconductor wafer lapping and polishing via metal removal processes. Meets HTS 8459.41.0010 criteria as rebuilt equipment for precision boring in line with statistical note wafer preparation tools.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Conduct pre-shipment inspection by certified engineer to document condition and refute 'new' claims at entry
• Prepare technical specs confirming metal removal (not just positioning) to stay in Chapter 84 machine tools
• Watch for EPA compliance if coolant systems contain restricted substances common in rebuilt machining centers