Used Wafer Chuck Boring Machine from Mexico

Used precision boring machine for machining semiconductor wafer chucks from metal blocks, ensuring flatness for processing. HTS 8459.29.00.10 for rebuilt boring by metal removal. Ties to wafer preparation equipment indirectly.

Duty Rate — Mexico → United States

14.2%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Provide micrometer tolerance proofs; sub-micron claims need lab validation

Declare as 'semiconductor tooling machine' for correct statistical reporting

Used Wafer Chuck Boring Machine from Mexico — Import Duty Rate | HTS 8459.29.00.10