8459.29.00.10/Used Wafer Chuck Boring Machine/Japan

Used Wafer Chuck Boring Machine from Japan

Used precision boring machine for machining semiconductor wafer chucks from metal blocks, ensuring flatness for processing. HTS 8459.29.00.10 for rebuilt boring by metal removal. Ties to wafer preparation equipment indirectly.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide micrometer tolerance proofs; sub-micron claims need lab validation

• Declare as 'semiconductor tooling machine' for correct statistical reporting