UV Laser Micromachining Workstation from Japan
This workstation uses ultraviolet photon beam technology to precisely remove material from substrates like ceramics and polymers for microelectronics manufacturing. It falls under HTS 8456.12.90.00 as a machine tool operated by other light or photon beam processes (non-laser), specifically UV excimer beams for material ablation. Designed for high-precision work in semiconductor packaging and MEMS fabrication.
Duty Rate — Japan → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify equipment qualifies as 'other photon beam' via technical specs; lasers go to 8456.11 while UV/excimer may shift to alternatives
• Include detailed process descriptions and end-use certificates to avoid misclassification as Chapter 90 optical apparatus