Other
Machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron-beam, ionic-beam or plasma arc processes; water-jet cutting machines: > Operated by laser or other light or photon beam processes > Operated by other light or photon beam processes: > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8456.12.90.00
Photon Beam Wafer Trimming Machine
Machine employing non-laser photon beams to trim resistor networks and passive components on semiconductor wafers to precise values. Under HTS 8456.12.90.00 for other photon beam material removal processes in semiconductor processing. Ensures tight tolerances for analog IC production.
Plasma-Induced Photon Beam Ablator
Hybrid system generating photons via plasma discharge for selective material ablation in wafer preparation. Classified HTS 8456.12.90.00 for photon beam processes distinct from direct plasma arc. Used for surface cleaning before epitaxy.
Femtosecond Pulse Photon Slicer
Ultrafast photon pulse system for cold ablation slicing of thin semiconductor films without heat-affected zones. HTS 8456.12.90.00 for other light beam processes in material working. Applied in flexible electronics fab.
Synchrotron Photon Etching Station
Lab-scale station using synchrotron-generated soft X-ray photons for photochemical etching of semiconductor surfaces. Under HTS 8456.12.90.00 as specialized photon beam material removal tool. For R&D in novel device structures.
UV Laser Micromachining Workstation
This workstation uses ultraviolet photon beam technology to precisely remove material from substrates like ceramics and polymers for microelectronics manufacturing. It falls under HTS 8456.12.90.00 as a machine tool operated by other light or photon beam processes (non-laser), specifically UV excimer beams for material ablation. Designed for high-precision work in semiconductor packaging and MEMS fabrication.
Excimer Laser Ablation System
An excimer-based photon beam system for photoablation of thin films in semiconductor device fabrication, removing material layer-by-layer without thermal damage. Classified in HTS 8456.12.90.00 for other light/photon beam processes beyond standard lasers. Ideal for patterning insulators and metals on wafers.
Ionic Beam Etching Tool
Uses focused ionic beams (charged particle streams with photon assist) for anisotropic etching of semiconductor surfaces during device fabrication. HTS 8456.12.90.00 covers other light/photon beam processes including ionic variants for material removal. Key for gate formation in advanced nodes.
Deep UV Photolithography Etcher
Deep ultraviolet photon beam etcher for post-exposure bake and develop processes, removing photoresist material from patterned wafers. Falls under HTS 8456.12.90.00 as other photon beam-operated machine tools for semiconductor working. Supports sub-10nm node patterning.