Photon Beam Wafer Trimming Machine from Germany
Machine employing non-laser photon beams to trim resistor networks and passive components on semiconductor wafers to precise values. Under HTS 8456.12.90.00 for other photon beam material removal processes in semiconductor processing. Ensures tight tolerances for analog IC production.
Duty Rate — Germany → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit wafer processing qualification data showing material removal function to Customs
• Label with safety interlocks and emission specs for photon beam hazards
• Avoid reclassification by excluding probe stations, which lean toward Chapter 90 testing gear