Excimer Laser Ablation System from Japan
An excimer-based photon beam system for photoablation of thin films in semiconductor device fabrication, removing material layer-by-layer without thermal damage. Classified in HTS 8456.12.90.00 for other light/photon beam processes beyond standard lasers. Ideal for patterning insulators and metals on wafers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document excimer wavelength (e.g
• 193nm ArF) to distinguish from lasers; provide beam process diagrams
• Comply with export control regs (EAR/ITAR) for dual-use semiconductor tech; declare precise removal capabilities