Excimer Laser Ablation System from China
An excimer-based photon beam system for photoablation of thin films in semiconductor device fabrication, removing material layer-by-layer without thermal damage. Classified in HTS 8456.12.90.00 for other light/photon beam processes beyond standard lasers. Ideal for patterning insulators and metals on wafers.
Duty Rate — China → United States
37.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document excimer wavelength (e.g
• 193nm ArF) to distinguish from lasers; provide beam process diagrams
• Comply with export control regs (EAR/ITAR) for dual-use semiconductor tech; declare precise removal capabilities