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Excimer Laser Ablation System from Canada

An excimer-based photon beam system for photoablation of thin films in semiconductor device fabrication, removing material layer-by-layer without thermal damage. Classified in HTS 8456.12.90.00 for other light/photon beam processes beyond standard lasers. Ideal for patterning insulators and metals on wafers.

Duty Rate — Canada → United States

12.4%

Rate breakdown

9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter

Import Tips

Document excimer wavelength (e.g

193nm ArF) to distinguish from lasers; provide beam process diagrams

Comply with export control regs (EAR/ITAR) for dual-use semiconductor tech; declare precise removal capabilities