Deep UV Photolithography Etcher from Mexico
Deep ultraviolet photon beam etcher for post-exposure bake and develop processes, removing photoresist material from patterned wafers. Falls under HTS 8456.12.90.00 as other photon beam-operated machine tools for semiconductor working. Supports sub-10nm node patterning.
Duty Rate — Mexico → United States
12.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Distinguish from exposure tools (Chapter 90) by emphasizing removal function in manuals
• Calibrate import declarations with cleanroom compatibility ratings