Deep UV Photolithography Etcher from Mexico
Deep ultraviolet photon beam etcher for post-exposure bake and develop processes, removing photoresist material from patterned wafers. Falls under HTS 8456.12.90.00 as other photon beam-operated machine tools for semiconductor working. Supports sub-10nm node patterning.
Duty Rate — Mexico → United States
12.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Distinguish from exposure tools (Chapter 90) by emphasizing removal function in manuals
• Calibrate import declarations with cleanroom compatibility ratings