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8456.12.90.00/Deep UV Photolithography Etcher/Japan

Deep UV Photolithography Etcher from Japan

Deep ultraviolet photon beam etcher for post-exposure bake and develop processes, removing photoresist material from patterned wafers. Falls under HTS 8456.12.90.00 as other photon beam-operated machine tools for semiconductor working. Supports sub-10nm node patterning.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Distinguish from exposure tools (Chapter 90) by emphasizing removal function in manuals

• Calibrate import declarations with cleanroom compatibility ratings

Deep UV Photolithography Etcher from Japan — Import Duty Rate | HTS 8456.12.90.00