Deep UV Photolithography Etcher from Japan
Deep ultraviolet photon beam etcher for post-exposure bake and develop processes, removing photoresist material from patterned wafers. Falls under HTS 8456.12.90.00 as other photon beam-operated machine tools for semiconductor working. Supports sub-10nm node patterning.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Distinguish from exposure tools (Chapter 90) by emphasizing removal function in manuals
• Calibrate import declarations with cleanroom compatibility ratings