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8456.12.70.00/UV Laser Singulation Machine for PCBs/Japan

UV Laser Singulation Machine for PCBs from Japan

Machine for singulating semiconductor packages mounted on PCB carriers using UV laser photon beams for clean, stress-free separation. Used principally in printed circuit assembly for heading 8517 parts. Classified under HTS 8456.12.70.00 for PCB-specific applications.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Prove singulation targets PCB-mounted devices; secure laser class certifications; track value of integrated vision systems

UV Laser Singulation Machine for PCBs from Japan — Import Duty Rate | HTS 8456.12.70.00