UV Laser Singulation Machine for PCBs from Japan
Machine for singulating semiconductor packages mounted on PCB carriers using UV laser photon beams for clean, stress-free separation. Used principally in printed circuit assembly for heading 8517 parts. Classified under HTS 8456.12.70.00 for PCB-specific applications.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Prove singulation targets PCB-mounted devices; secure laser class certifications; track value of integrated vision systems