UV Laser PCB Depaneling System from Japan
A UV photon beam system that precisely cuts individual PCBs from production panels by ablating material along scored lines without mechanical stress. Principally used in high-volume printed circuit assembly lines for electronics like smartphones. Falls under HTS 8456.12.70.00 for its dedicated role in printed circuit manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include technical datasheets proving depaneling is for PCBs only; declare laser wavelength to confirm photon beam process; watch for pitfalls in valuing software-integrated systems separately