UV Laser PCB Depaneling System from Japan
A UV photon beam system that precisely cuts individual PCBs from production panels by ablating material along scored lines without mechanical stress. Principally used in high-volume printed circuit assembly lines for electronics like smartphones. Falls under HTS 8456.12.70.00 for its dedicated role in printed circuit manufacturing.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include technical datasheets proving depaneling is for PCBs only; declare laser wavelength to confirm photon beam process; watch for pitfalls in valuing software-integrated systems separately