Photon Beam PCB Via Ablation Tool from Japan
Advanced tool using non-laser photon beams to ablate precise vias in multi-layer PCB substrates for high-speed data processing components. Exclusively for manufacturing parts of automatic data processing machines. HTS 8456.12.70.00 applies due to its specific use in printed circuit production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document principal use with marketing materials and buyer contracts; ensure CE marking for EU re-export compliance; avoid misdeclaration by specifying photon beam vs. mechanical removal