Laser Micro-Machining Station for PCAs from Japan
Compact station for laser micro-machining features like cavities and trenches in printed circuit assemblies (PCAs) using other light beams for 5G modules. Solely for high-precision electronics parts under heading 8517. HTS 8456.12.70.00 due to dedicated PCB/PCA application.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit photos and videos of machine in PCB operation for binding rulings; ensure firmware locks to PCB modes only; budget for vibration isolation in shipping