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Laser Micro-Machining Station for PCAs from Japan

Compact station for laser micro-machining features like cavities and trenches in printed circuit assemblies (PCAs) using other light beams for 5G modules. Solely for high-precision electronics parts under heading 8517. HTS 8456.12.70.00 due to dedicated PCB/PCA application.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Submit photos and videos of machine in PCB operation for binding rulings; ensure firmware locks to PCB modes only; budget for vibration isolation in shipping