Wafer Edge Profiling Roll from Japan
Roll used in wafer grinders to create precise edge profiles on semiconductor wafers for handling and breakage prevention. HTS 8455.30.00.65 for <2,268 kg rolling mill rolls in semiconductor wafer preparation. Meets industry standards for edge strength.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Document edge profile specs (laser diced, beveled) per SEMI M1 standards
• Ensure roll materials prevent contamination
• Pitfall: weight mismeasurement causing tariff escalation