Wafer Edge Profiling Roll from Canada
Roll used in wafer grinders to create precise edge profiles on semiconductor wafers for handling and breakage prevention. HTS 8455.30.00.65 for <2,268 kg rolling mill rolls in semiconductor wafer preparation. Meets industry standards for edge strength.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document edge profile specs (laser diced, beveled) per SEMI M1 standards
• Ensure roll materials prevent contamination
• Pitfall: weight mismeasurement causing tariff escalation