8455.30.00.65/Wafer Backside Grinder Roll/Mexico

Wafer Backside Grinder Roll from Mexico

Roll specifically for thinning wafer backside to target thickness while preserving frontside device layers in semiconductor packaging. HTS 8455.30.00.65 for <2,268 kg rolls in wafer preparation equipment. Enables 3D stacking and advanced packaging.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include TAIKO ring grinding process documentation if applicable

• Specify backside damage layer specs

• Avoid classification with general lapping equipment

Wafer Backside Grinder Roll from Mexico — Import Duty Rate | HTS 8455.30.00.65