Wafer Backside Grinder Roll from Germany
Roll specifically for thinning wafer backside to target thickness while preserving frontside device layers in semiconductor packaging. HTS 8455.30.00.65 for <2,268 kg rolls in wafer preparation equipment. Enables 3D stacking and advanced packaging.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include TAIKO ring grinding process documentation if applicable
• Specify backside damage layer specs
• Avoid classification with general lapping equipment