Wafer Backside Grinder Roll from Canada
Roll specifically for thinning wafer backside to target thickness while preserving frontside device layers in semiconductor packaging. HTS 8455.30.00.65 for <2,268 kg rolls in wafer preparation equipment. Enables 3D stacking and advanced packaging.
Duty Rate — Canada → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Include TAIKO ring grinding process documentation if applicable
• Specify backside damage layer specs
• Avoid classification with general lapping equipment