Test Wafer Qualification Roll from Japan
Roll used in qualification grinders for monitor/test wafers that calibrate semiconductor processing tools. Under HTS 8455.30.00.65 as ≤2,268 kg rolling mill roll for semiconductor wafer processing equipment. Ensures process control standards.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document use for SEMI M1 monitor wafers and process qualification
• Weight and balance certification critical
• Pitfall: classifying as R&D equipment instead of production tooling