SOI Wafer Bond Layer Roll from Germany
Specialized roll for applying uniform bond layers in Silicon-on-Insulator (SOI) wafer processing equipment. Under HTS 8455.30.00.65 as ≤2,268 kg rolling mill roll for advanced semiconductor wafer manufacturing. Ensures oxide layer consistency.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Document SOI process (SIMOX/Smart Cut) and layer thickness specs
• Reference statistical notes for advanced semiconductor materials
• Pitfall: classifying under chemical coating equipment