Silicon Wafer Slicing Support Roll from Mexico
Precision support roll for wafer slicing saws that maintain tension and alignment during boule slicing into thin semiconductor wafers. Fits HTS 8455.30.00.65 for rolling mill rolls under 2,268 kg in semiconductor processing equipment. Ensures uniform wafer thickness for subsequent grinding.
Duty Rate — Mexico → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Provide saw blade tension specs and wafer thickness tolerance data
• Label clearly for semiconductor slicing vs general metal cutting
• Avoid bulk packaging that obscures individual roll weights