Silicon Wafer Slicing Support Roll from China
Precision support roll for wafer slicing saws that maintain tension and alignment during boule slicing into thin semiconductor wafers. Fits HTS 8455.30.00.65 for rolling mill rolls under 2,268 kg in semiconductor processing equipment. Ensures uniform wafer thickness for subsequent grinding.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide saw blade tension specs and wafer thickness tolerance data
• Label clearly for semiconductor slicing vs general metal cutting
• Avoid bulk packaging that obscures individual roll weights