Semiconductor Boule Diameter Grinding Roll from Mexico
Roll designed for crystal grinders that shape semiconductor boules to exact wafer diameters, incorporating flats for conductivity indication. Under HTS 8455.30.00.65 as a rolling mill roll ≤2,268 kg for wafer preparation in semiconductor manufacturing. Critical step before slicing into wafers.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document boule grinding tolerances and semiconductor resistivity flat specifications
• Ensure roll surface materials are certified non-contaminating for silicon processing
• Common pitfall: incorrect weight declaration leading to higher tariff subheading