Semiconductor Boule Diameter Grinding Roll from China
Roll designed for crystal grinders that shape semiconductor boules to exact wafer diameters, incorporating flats for conductivity indication. Under HTS 8455.30.00.65 as a rolling mill roll ≤2,268 kg for wafer preparation in semiconductor manufacturing. Critical step before slicing into wafers.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document boule grinding tolerances and semiconductor resistivity flat specifications
• Ensure roll surface materials are certified non-contaminating for silicon processing
• Common pitfall: incorrect weight declaration leading to higher tariff subheading