8455.30.00.65/Precision Wafer Thickness Control Roll/Mexico

Precision Wafer Thickness Control Roll from Mexico

Roll in wafer grinders that maintains consistent thickness across semiconductor wafers during back-grinding process. HTS 8455.30.00.65 for <2,268 kg rolls in rolling mills for semiconductor wafer preparation equipment. Achieves ±1 micron uniformity.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include thickness uniformity specs and TTV (total thickness variation) data

• Certify for 200mm/300mm wafer compatibility

• Avoid classification as measuring instrument despite precision function

Precision Wafer Thickness Control Roll from Mexico — Import Duty Rate | HTS 8455.30.00.65