Precision Wafer Thickness Control Roll from Germany
Roll in wafer grinders that maintains consistent thickness across semiconductor wafers during back-grinding process. HTS 8455.30.00.65 for <2,268 kg rolls in rolling mills for semiconductor wafer preparation equipment. Achieves ±1 micron uniformity.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include thickness uniformity specs and TTV (total thickness variation) data
• Certify for 200mm/300mm wafer compatibility
• Avoid classification as measuring instrument despite precision function