Gallium Arsenide Wafer Lapping Roll from Japan
High-precision lapping roll for processing GaAs wafers to exact flatness and dimensional tolerances required for semiconductor fabrication. Classified HTS 8455.30.00.65 as rolling mill roll <2,268 kg per statistical notes for compound semiconductor processing. Prepares surface before fabrication steps.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify GaAs compatibility and flatness tolerances (e.g
• <1 micron) in technical docs
• Include statistical note reference for compound semiconductors
• Pitfall: misdeclared weight triggering 8455.30.0080 rate