Gallium Arsenide Wafer Lapping Roll from China
High-precision lapping roll for processing GaAs wafers to exact flatness and dimensional tolerances required for semiconductor fabrication. Classified HTS 8455.30.00.65 as rolling mill roll <2,268 kg per statistical notes for compound semiconductor processing. Prepares surface before fabrication steps.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify GaAs compatibility and flatness tolerances (e.g
• <1 micron) in technical docs
• Include statistical note reference for compound semiconductors
• Pitfall: misdeclared weight triggering 8455.30.0080 rate